Product Specification

• Form Factor

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  Micro-ATX

• Processor Type

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  Intel® Core™ i7/i5/i3 and other Intel® processors in the LGA1155 package

• Memory

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  • Two 240-pin, DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
  • Support for DDR3 1333/1066 MHz DIMMs
  • Support for up to 16 GB of system memory

• Chipset

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  Intel® H61 Express Chipset

• Slots

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  • One PCI Express* 3.0 x 16 graphics connectors
  • Two PCI Express* x 1 connectors

• BIOS

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  • • 32 Mb Flash EEPROM with Intel® Platform Innovation
  • Framework for EFI Plug and Play
  • • Advanced configuration and power interface V3.0b,
  • SMBIOS2.5
  • • Intel® Express BIOS update support

• Peripheral interfaces

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  • Two SATA (3.0 Gb/s) ports
  • Integrated 10/100/1000 Network Connection
  • Eight Hi-Speed USB 2.0 ports (four back panel ports
  • and four additional ports via internal headers

• Others

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  • Audio
  • • Six-channel Intel® High Definition Audio6 codec
  • Jumpers and Front -Pan el Conn ecto rs
  • Jumpers
  • • Single configuration jumper design
  • • Jumper access for BIOS maintenance mode
  • Front-Panel Connectors
  • • Reset, HDD LED, Power LEDs, power on/off
  • • Front-panel Hi-Speed USB 2.0 headers
  • • Front-panel audio header